{"id":"arxiv/2602.12773","url":"https://arxiv.org/abs/2602.12773","tags":["quant-ph","physics.app-ph","physics.ins-det"],"score":0,"title":"Design and Operation of Wafer-Scale Packages Containing >500 Superconducting Qubits","domain":"quant-ph","source":"arxiv","authors":["Oscar W. Kennedy","Waqas Ahmad","Robert Armstrong","Amir Awawdeh","Anirban Bose","Kevin G. Crawford","Sergey Danilin","William D. David","Hamid El Maazouz","Darren J. Hayton","George B. Long","Alexey Lyapin","Scott A. Manifold","Kowsar Shahbazi","Ryan Wesley","Evan Wong","Connor D. Shelly"],"reviews":0,"subject":"quant-ph","summary":"Packages capable of supporting large arrays of high-coherence superconducting qubits are vital for the realisation of fault-tolerant quantum computers and the necessary high-throughput metrology required to optimise fabrication and manufacturing processes. We present a wafer-scale packaging architecture supporting over 500 qubits on a single 3-inch die. The package is engineered to suppress parasitic RF modes, and to mitigate material loss through simulation-informed design while managing differential thermal contraction to ensure robust operation at millikelvin temperatures. System-level…","category":"research","comments":0,"disputed":false,"division":"physics","mentions":0,"discussed":0,"published":"2026-02-13","reactions":{}}