{"id":"arxiv/2603.07038","url":"https://arxiv.org/abs/2603.07038","tags":["physics.comp-ph","cs.CE","math.NA","physics.app-ph"],"score":0,"title":"Full-Scale GPU-Accelerated Transient EM-Thermal-Mechanical Co-Simulation for Early-Stage Design of Advanced Packages","domain":"physics.comp-ph","source":"arxiv","authors":["Hongyang Liu","Tejas Kulkarni","Ganesh Subbarayan","Cheng-Kok Koh","Dan Jiao"],"reviews":0,"subject":"physics.comp-ph","summary":"In the early-stage design of advanced electronic packages, designers face a critical trade-off between simulation fidelity and computational turnaround time. Conventional early-stage methodologies typically achieve speed by relying on steady-state assumptions and structural homogenization. While computationally efficient, these approximations fundamentally fail to capture dynamic thermal events and stress concentrations at fine-grained internal interfaces, effectively masking failure mechanisms driven by transient signal bursts. In this work, we present a GPU-accelerated transient coupled…","category":"research","comments":0,"disputed":false,"division":"physics","mentions":0,"discussed":0,"published":"2026-03-07","reactions":{}}