{"id":"arxiv/2605.11488","url":"https://arxiv.org/abs/2605.11488","tags":["quant-ph"],"score":0,"title":"Breaking the scalability barrier via a vertical tunable coupler in 3D integrated transmon system","domain":"quant-ph","source":"arxiv","authors":["Xudong Liao","Shuyi Pan","Zhenxing Zhang","Sainan Huai","Zhiwen Zong","Xiaopei Yang","Kunliang Bu","Wen Zheng","Xinsheng Tan","Yang Yu","Yuan Li","Yi-Cong Zheng","Tianqi Cai","Shengyu Zhang"],"reviews":0,"subject":"quant-ph","summary":"Scaling superconducting quantum processors beyond the constraints of monolithic planar architectures is essential for fault-tolerant quantum computation. Here we demonstrate a three-dimensional (3D) integrated superconducting quantum processor in which two qubit chips are vertically stacked on opposing sides of a carrier chip and galvanically connected via multilayer flip-chip bonding. Intrachip qubit coupling is mediated by planar tunable couplers, whereas interchip coupling is enabled by vertical tunable couplers embedded in the carrier chip. Randomized benchmarking reveals simultaneous…","category":"research","comments":0,"disputed":false,"division":"physics","mentions":0,"discussed":0,"published":"2026-05-12","reactions":{}}