{"id":"arxiv/2607.00364","url":"https://arxiv.org/abs/2607.00364","tags":["math.NA"],"score":0,"title":"WarpagePINN: Thermal Warpage Prediction in Advanced Packaging via a Two-Stage Physics-Informed Neural Networks","domain":"math.NA","source":"arxiv","authors":["Xinyu Li","Min Tang","Zeyu Sun","Wenxing Zhu","Jianhua Zhang","Liang Chen"],"reviews":0,"subject":"math.NA","summary":"Thermal warpage has become a critical issue in advanced packaging, primarily caused by the mismatch in coefficients of thermal expansion (CTE) among heterogeneously integrated materials. However, only a limited number of studies have focused on developing computational methods for coupled thermal-warpage prediction in the chiplet. This paper proposes a two-stage physics-informed neural network (WarpagePINN) framework to compute both temperature profile and warpage deformation of chiplets. The neural networks are trained without relying on labeled datasets generated by conventional…","category":"research","comments":0,"disputed":false,"division":"math","mentions":0,"discussed":0,"published":"2026-07-01","reactions":{}}