{"id":"arxiv/2608.07306","url":"https://arxiv.org/abs/2608.07306","tags":["quant-ph"],"score":0,"title":"Flip-chip integrated superconducting qubits using electroplated bump bonds","domain":"quant-ph","source":"arxiv","authors":["Yen-An Shih","Rebecca Gharibaan","Barka Khan","Dhananjay Joshi","Siddharth Singh","Martijn F. S. Zwanenburg","Eugene Y. Huang","Nataliia Zhurbina","Figen Yilmaz","Lukas Johannes Splitthoff","Srijit Goswami","Christian Kraglund Andersen"],"reviews":0,"subject":"quant-ph","summary":"Flip-chip integration offers a promising route toward scalable superconducting quantum processors and hybrid semiconductor-superconductor quantum devices. We develop a three-dimensional transmon architecture using electroplated indium in which the qubit electric field is shared nearly equally between two bump-bonded substrates while maintaining low participation at the indium-bump interface. The resulting geometry is well suited for future hybrid qubits, enabling the integration of distinct material platforms while minimizing sensitivity to bump-interface loss. Using this platform, we…","category":"research","comments":0,"disputed":false,"division":"physics","mentions":0,"discussed":0,"published":"2026-08-07","reactions":{}}