{"id":"arxiv/2610.08543","url":"https://arxiv.org/abs/2610.08543","tags":["math.NA"],"score":0,"title":"A Cut Finite Element Method for Transient Thermal Simulation in Multi-material Electronic Packaging Structures","domain":"math.NA","source":"arxiv","authors":["Hao Dong"],"reviews":0,"subject":"math.NA","summary":"Advanced electronic packaging structures represent a key technological approach for extending Moore's Law. An electronic packaging structure consists of multiple materials with distinct properties, constituting a composite structure with complex spatial architecture. This paper develops an unfitted cut finite element method (CutFEM) for transient heat conduction simulation in multi-material electronic packaging structures with complex material interfaces. In the proposed computational framework, the heterogeneous spatial geometric features of electronic packaging structures is embedded and…","category":"research","comments":0,"disputed":false,"division":"math","mentions":0,"discussed":0,"published":"2026-10-06","reactions":{}}