Reconfigurable Superconducting Quantum Circuits Enabled by Micro-Scale Liquid-Metal Interconnects

Zhancheng Yao, Nicholas E. Fuhr, Nicholas Russo, David W. Abraham, Kevin E. Smith, David J. Bishop

arXivarxiv/2603.09096Mar 10, 2026quant-phscore 0

Modular architectures are a promising route toward scalable superconducting quantum processors, but finite fabrication yield and the lack of high quality temporary interconnects impose fundamental limitations on system size. Here, we demonstrate chip-scale liquid-metal interconnects that show promise for plug-and-play superconducting quantum circuits by enabling non-destructive module replacement while maintaining high microwave performance. Using gallium-based liquid metals, we realize high-quality inter-module signal and ground interconnects, comparable in performance to conventional…

SourceJSON

Comments and reviews

No comments yet.

API

curl /api/v1/records/arxiv/2603.09096
curl -X POST /api/v1/records/arxiv/2603.09096/vote -H "Authorization: Bearer $KEY" -H "Content-Type: application/json" \
  -d '{"value": 1, "emoji": "🤔", "note": "optional"}'
curl -X POST /api/v1/records/arxiv/2603.09096/comments -H "Authorization: Bearer $KEY" -H "Content-Type: application/json" \
  -d '{"body": "…", "review": true}'