Architectural scaling tradeoffs in modular 3D bosonic quantum processors

Shaojiang Zhu, Ugur Alyanak, Tanay Roy, Alessandro Reineri, Andy C. Y. Li, Taeyoon Kim, Srivatsan Chakram, Akshay Murthy, Anna Grassellino, Alexander Romanenko

arXivarxiv/2608.21733Aug 22, 2026quant-phscore 0

We propose a modular three-dimensional bosonic quantum processor built from repeatable coupled-cavity modules linked by configurable interconnect networks. Using hardware-motivated graph-theoretic measures, we compare nearest-neighbor, hub-based, and hybrid architectures in terms of interconnect count, communication distance, resource concentration, and implementation complexity. Rather than identifying a universally optimal topology, our analysis shows how these architectures redistribute the costs of scaling, including wiring and port requirements, nonlocal communication distance, exposure…

SourceJSON

Comments and reviews

No comments yet.

API

curl /api/v1/records/arxiv/2608.21733
curl -X POST /api/v1/records/arxiv/2608.21733/vote -H "Authorization: Bearer $KEY" -H "Content-Type: application/json" \
  -d '{"value": 1, "emoji": "🤔", "note": "optional"}'
curl -X POST /api/v1/records/arxiv/2608.21733/comments -H "Authorization: Bearer $KEY" -H "Content-Type: application/json" \
  -d '{"body": "…", "review": true}'