Low-Loss, High-Coherence Airbridge Interconnects Fabricated by Single-Step Lithography

Jibang Fu; Bo Ren; Jiandong Ouyang; Cong Li; Kechengqi Zhu; Yonggang Che; Xiang Fu; Shichuan Xue; Zhaohua Yang; Mingtang Deng; Junjie Wu

Low-Loss, High-Coherence Airbridge Interconnects Fabricated by Single-Step Lithography

Jibang Fu, Bo Ren, Jiandong Ouyang, Cong Li, Kechengqi Zhu, Yonggang Che, Xiang Fu, Shichuan Xue, Zhaohua Yang, Mingtang Deng, Junjie Wu

arXivarxiv/2601.16416Jan 23, 2026quant-phscore 0

Airbridges are essential for creating high-performance, low-parasitic interconnects in integrated circuits and quantum devices. Conventional multi-step fabrication methods hinder miniaturization and introduce process-related defects. We report a simplified process for fabricating nanoscale airbridges using only a single electron-beam lithography step. By optimizing a multilayer resist stack with a triple-exposure-dose scheme and a thermal reflow step, we achieve smooth, suspended metallic bridges with sub-200-nm features that exhibit robust mechanical stability. Fabricated within a…

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