Design and Operation of Wafer-Scale Packages Containing >500 Superconducting Qubits

Oscar W. Kennedy, Waqas Ahmad, Robert Armstrong, Amir Awawdeh, Anirban Bose, Kevin G. Crawford, Sergey Danilin, William D. David, Hamid El Maazouz, Darren J. Hayton, George B. Long, Alexey Lyapin, Scott A. Manifold, Kowsar Shahbazi, Ryan Wesley, Evan Wong, Connor D. Shelly

arXivarxiv/2602.12773Feb 13, 2026quant-phscore 0

Packages capable of supporting large arrays of high-coherence superconducting qubits are vital for the realisation of fault-tolerant quantum computers and the necessary high-throughput metrology required to optimise fabrication and manufacturing processes. We present a wafer-scale packaging architecture supporting over 500 qubits on a single 3-inch die. The package is engineered to suppress parasitic RF modes, and to mitigate material loss through simulation-informed design while managing differential thermal contraction to ensure robust operation at millikelvin temperatures. System-level…

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