Full-Scale GPU-Accelerated Transient EM-Thermal-Mechanical Co-Simulation for Early-Stage Design of Advanced Packages

Hongyang Liu, Tejas Kulkarni, Ganesh Subbarayan, Cheng-Kok Koh, Dan Jiao

arXivarxiv/2603.07038Mar 7, 2026physics.comp-phscore 0

In the early-stage design of advanced electronic packages, designers face a critical trade-off between simulation fidelity and computational turnaround time. Conventional early-stage methodologies typically achieve speed by relying on steady-state assumptions and structural homogenization. While computationally efficient, these approximations fundamentally fail to capture dynamic thermal events and stress concentrations at fine-grained internal interfaces, effectively masking failure mechanisms driven by transient signal bursts. In this work, we present a GPU-accelerated transient coupled…

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