Die to wafer direct bonding of (100) single-crystal diamond thin films for quantum optoelectronics

Dominic Lepage, Amin Yaghoobi, Heidi Tremblay, Dominique Drouin

arXivarxiv/2603.17140Mar 17, 2026quant-phscore 0

This work unlocks the manufacturing of nanophotonic quantum systems that exploit the unique material properties of single-crystal diamond (SCD). We achieve this by introducing a semiconductor-compatible process for the direct bonding of multiple high-quality, ultrathin diamond films onto a carrier wafer, enabling the subsequent parallel nanofabrication of optoelectronic integrated circuits. Central to this approach is a new diamond surface-preparation method that avoids boiling tri-acid mixtures while producing exceptionally clean 20 um thin single crystals. These platelets are bonded…

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