Breaking the scalability barrier via a vertical tunable coupler in 3D integrated transmon system

Xudong Liao, Shuyi Pan, Zhenxing Zhang, Sainan Huai, Zhiwen Zong, Xiaopei Yang, Kunliang Bu, Wen Zheng, Xinsheng Tan, Yang Yu, Yuan Li, Yi-Cong Zheng, Tianqi Cai, Shengyu Zhang

arXivarxiv/2605.11488May 12, 2026quant-phscore 0

Scaling superconducting quantum processors beyond the constraints of monolithic planar architectures is essential for fault-tolerant quantum computation. Here we demonstrate a three-dimensional (3D) integrated superconducting quantum processor in which two qubit chips are vertically stacked on opposing sides of a carrier chip and galvanically connected via multilayer flip-chip bonding. Intrachip qubit coupling is mediated by planar tunable couplers, whereas interchip coupling is enabled by vertical tunable couplers embedded in the carrier chip. Randomized benchmarking reveals simultaneous…

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