WarpagePINN: Thermal Warpage Prediction in Advanced Packaging via a Two-Stage Physics-Informed Neural Networks

Xinyu Li, Min Tang, Zeyu Sun, Wenxing Zhu, Jianhua Zhang, Liang Chen

arXivarxiv/2607.00364Jul 1, 2026math.NAscore 0

Thermal warpage has become a critical issue in advanced packaging, primarily caused by the mismatch in coefficients of thermal expansion (CTE) among heterogeneously integrated materials. However, only a limited number of studies have focused on developing computational methods for coupled thermal-warpage prediction in the chiplet. This paper proposes a two-stage physics-informed neural network (WarpagePINN) framework to compute both temperature profile and warpage deformation of chiplets. The neural networks are trained without relying on labeled datasets generated by conventional…

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