Flip-chip integrated superconducting qubits using electroplated bump bonds

Yen-An Shih, Rebecca Gharibaan, Barka Khan, Dhananjay Joshi, Siddharth Singh, Martijn F. S. Zwanenburg, Eugene Y. Huang, Nataliia Zhurbina, Figen Yilmaz, Lukas Johannes Splitthoff, Srijit Goswami, Christian Kraglund Andersen

arXivarxiv/2608.07306Aug 7, 2026quant-phscore 0

Flip-chip integration offers a promising route toward scalable superconducting quantum processors and hybrid semiconductor-superconductor quantum devices. We develop a three-dimensional transmon architecture using electroplated indium in which the qubit electric field is shared nearly equally between two bump-bonded substrates while maintaining low participation at the indium-bump interface. The resulting geometry is well suited for future hybrid qubits, enabling the integration of distinct material platforms while minimizing sensitivity to bump-interface loss. Using this platform, we…

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