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A Cut Finite Element Method for Transient Thermal Simulation in Multi-material Electronic Packaging Structures

Hao Dong

arXivarxiv/2610.08543Oct 6, 2026math.NAscore 0

Advanced electronic packaging structures represent a key technological approach for extending Moore's Law. An electronic packaging structure consists of multiple materials with distinct properties, constituting a composite structure with complex spatial architecture. This paper develops an unfitted cut finite element method (CutFEM) for transient heat conduction simulation in multi-material electronic packaging structures with complex material interfaces. In the proposed computational framework, the heterogeneous spatial geometric features of electronic packaging structures is embedded and…

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